At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
Strategic Space Systems Division (SSSD) is an industry-leading provider for prime satellite and payload capabilities and directed energy and electronics solutions for national security, military, and civil customers. We are built on a heritage of providing innovative, affordable and reliable aerospace and defense products that our customers rely on to achieve mission success. Join the Space revolution and make the impossible, possible.
Northrop Grumman Strategic Space Systems Division (SSSD) has an opening for a Senior Principal Semiconductor Microelectronics Engineer to join our team of qualified, diverse individuals. This position will be located in Manhattan Beach, CA.
As a Sr. Principal Microelectronics engineer you will support the research and development of advanced microelectronics products for the Northrop Grumman Microelectronics Center. You will be responsible for leading the development and maturation of novel III-V semiconductor technologies including 2.5D and 3D heterogeneous integration, advanced packaging, and wafer-level packaging. You will be able to lead multi-disciplinary teams to advance new technologies from early research and development to production. Responsibilities will include collaboration with materials, process, and reliability engineers in developing and carrying out device manufacturing flows, performance characterization, and failure analysis.
You thrive in a fast-paced work environment with high expectations, significantly diverse assignments, while in a collaborative team settings across all levels. You will be comfortable in a lab environment, be able to collaborate closely with process engineers, circuit designers, and test engineers, and perform as a technical leader. You are self-motivated, proactive, and able to independently find solutions to complex problems.
Essential Job Functions include, but are not limited to:
Work with senior process and product (integration) engineers to develop a holistic approach to Microelectronics heterogeneous integration technologies.
Develop heterogeneous process design kits (PDKs) and work with internal and external customers to maintain and troubleshoot such kits.
Hands-on utilization and development of BEOL process modules, wafer metrology techniques, and heterogeneous integration flows (chip-level and wafer-level)
Maintain existing processes and tools which include: monitoring processes using statistical process control (SPC) methods; process optimization; and trouble-shoot process issues.
Work in a team environment, using excellent communication and presentation skills to effectively interface with management and personnel from diverse backgrounds .
Mentor and support junior engineers through tasks and projects.
Bachelor's degree in STEM discipline with nine (9) years of experience in semiconductor process industry; OR Master's degree in STEM with seven (7) years of experience in semiconductor process industry; OR PhD in STEM with four (4) years of experience in semiconductor process industry
Experience working in cleanroom lab environment
Experience in semiconductor back-end-of-line wiring and/or packaging
Hands-on experience with semiconductor device process technology
Ability to obtain and maintain a DoD Secret clearance
PhD in STEM with microelectronics industry experience
Hands-on experience with die-level attach (thermocompression bonding)
Knowledge of semiconductor device physics
Experience as a lead engineer on semiconductor process technology development
Experience with technology maturation and transition from R&D to manufacturing (Si, III-V compound semiconductor, MEMS).
Excellent communication, interpersonal skills, and the ability to interface with all levels of employees and management.
Northrop Grumman offers a competitive and robust benefits program. As a full-time employee of Northrop Grumman, you are eligible for:
Medical, Dental & Vision coverage
Employee Assistance Programs & Work/Life Solutions
Paid Time Off
Health & Wellness Resources
Flexible Schedules: For example, some roles offer the ability to work a 9/80 work schedule, which allows an employee to work a nine-hour day Monday through Thursday and take every other Friday off of work
Salary Range: $129,700 - $194,500
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO . U.S. Citizenship is required for most positions.