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Northrop Grumman Sr. Principal IC Package Design and Modeling Engineer in Linthicum, Maryland



At the heart of Defining Possible is our commitment to missions. In rapidly changing global security environments, Northrop Grumman brings informed insights and software-secure technology to enable strategic planning. We're looking for innovators who can help us keep building on our wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies that fuel those missions. By joining in our shared mission, we'll support yours of expanding your personal network and developing skills, whether you are new to the field or an industry thought-leader. At Northrop Grumman, you'll have the resources, support, and team to do some of the best work of your career.

Northrop Grumman Mission Systems (NGMS) is actively hiring a Sr. Principal IC Package Design and Modeling Engineer for the Cyber & Intelligence Mission Solutions (CIMS) Organization. The position is located at the Advanced Technology Lab (ATL) - just outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor and superconducting products for internal and commercial production as well as emerging programs.

The Sr. Principal IC Package Design and Modeling Engineer will be responsible for all aspects of integrated circuit packaging, including packaging design, packaging processing, packaging modeling, packaging test, and packaging failure analysis.

Responsibilities include (but are not limited to):

  • Packaging design, package modeling and simulation

  • Mechanical stress simulation, thermal simulation, and electrical simulation for IC packaging

  • Parsing and analyzing large datasets to guide packaging process development and perform failure analysis for IC packaging.

Job Category : Engineering