Requisition ID: R10170102
Category: Engineering
Location: Beavercreek, Ohio, United States of America | Cincinnati, Ohio, United States of America | Dayton, Ohio, United States of America
Clearance Type: Polygraph
Telecommute: No- Teleworking not available for this position
Shift: 1st Shift (United States of America)
Travel Required: Yes, 10% of the Time
Relocation Assistance: Relocation assistance may be available
Positions Available: 1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
NG Microelectronics Center is seeking an Electromechanical Engineer in Beavercreek, OH (Dayton, OH) to support system packaging design and thermal analysis. We are seeking engineers with the desire to learn new technologies to join our innovative organization to help develop, enhance and maintain cutting edge products and systems.
Boasting state-of-the-art design capabilities, multiple processing nodes, electrical testing, environmental and QCI screening, and failure analysis, the NGMC is a leader in designing, fabricating, packaging, and delivering discriminating microelectronics to the military, aerospace, and commercial markets. For more than 70 years, we have been offering a wide range of trusted foundry and semiconductor services that deliver high performing and reliable microelectronics. Our wide breadth of technologies and capabilities allows us to provide our customers with unique “More than Moore” solutions.
The selected individual will work on designs across the full product life cycle process. In this capacity, you will utilize your working knowledge of analysis, development, qualification, and transition to production.
Are you seeking a challenging role with a strong team? Come define possible with us in Beavercreek, OH!
Duties include:
Mechanical Design by designing 3D Model of chassis, covers, digital and RF printed wiring board assemblies, heat sinks, internal and external cabling.
Create all mechanical drawings (component, printed wiring board assembly, sub-assembly and final assembly drawings and parts lists).
Interface with vendors and fabricators to ensure deliverables meet mechanical requirements to include thermal, vibration, and structural.
Rapid prototyping using 3D printers.
Perform Finite Element Modeling(FEA) and, thermal and structural analysis (ANSYS)
This position can be filled at the Principal Electromechanical Engineer or Senior Principal Electromechanical Engineer level.
Basic Qualifications for Principal Electromechanical Engineer:
Bachelor of Science (BS) degree in science, technology, engineering, or related discipline with at least 5 years of experience; 3 years with Masters Degree; OR 0 years with a PhD
Experience with a 3D CAD tool and MS Office
Knowledge of Finite Element Analysis(FEA) and CFD to solve thermal and structural problems
Must be a US Citizen
Clearance: must have or be able to obtain and maintain a Full Top Secret security clearance with Polygraph
Basic Qualifications for Sr. Principal Electromechanical Engineer:
Bachelor of Science (BS) degree in science, technology, engineering, or related discipline with at least 8 years of experience; 6 years with Masters Degree; OR 3 years with a PhD
Experience with a 3D CAD tool and MS Office
Knowledge of Finite Element Analysis(FEA) and CFD to solve thermal and structural problems
Must be a US Citizen
Clearance: must have or be able to obtain and maintain a Full Top Secret security clearance with Polygraph
Preferred Qualifications:
Active Top Secret Security Clearance
Experience with the following applications: SolidWorks, AutoCAD, Ansys Icepak
Experience taking multiple designs from concept through fabrication
Experience designing for, maintaining, and operating 3D printers
Experience with liquid cooled designs
#MDASEIT
#NGMCENG
Salary Range: $97,500 - $146,300
Salary Range 2: $121,000 - $181,400
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.