Northrop Grumman Mechanical Engineer, Microelectronics Packaging Design 2/3 in Baltimore, Maryland

Mechanical Engineer, Microelectronics Packaging Design 2/3

Requisition ID: 18002434

Location(s): United States-Maryland-Baltimore

US Citizenship Required for this Position: Yes

Relocation Assistance: Relocation assistance may be available

Travel: Yes, 10 % of the Time

Northrop Grumman is seeking a Mechanical Engineer- MicroelectronicsPackaging Design to join our team of qualified, diverse individuals. This position will be located in Baltimore, MD.

At Northrop Grumman Corporation, our employees have incredible opportunities to work on revolutionary systems in air and space that impact people’s lives around the world today, and for generations to come. Our work preserves freedom and democracy, and advances human discovery and our understanding of the universe. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have a lot of fun along the way. Our culture thrive on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they’re making history.

A Microelectronics Packaging design engineer needs to be able to interface with their RF design and digital counterparts and chip designers, pull the packaging design together for a project, coordinate for the thermal, structural and durability analysis, and coordinate for the design to go through drafting, supply chain and manufacturing. Applicant needs to have the background and knowledge of designing high density microelectronics packages, like multichip modules, that will allow them to perform with limited supervision very quickly after starting in the position.

An optimal candidate will have knowledge of design tools including 2D CAD (preferably AutoCAD), 3D CAD (preferably Siemens NX), and PWB design (preferably Mentor Expedition). Good understanding of packaging of organic and ceramic high density modules is desired. Candidate must possess or be able to obtain and maintain a secret clearance

Roles and Responsibilities:

  • Designing cutting edge analog and digital microelectronics solutions, utilizing multiple chip-scale packaging technologies including ceramic, organic, MCM, IMA, QFN, BGA, 3DI, Flip Chip and antenna tiles to support sub-system requirements

  • Interfacing with electrical design counterparts, chip designers, thermal and structural analysts, and manufacturing teams throughout the design phase

  • Coordinating with drafting, manufacturing, and supply chain teams to provide consultation as needed for successful fabrication and delivery of completed products

  • Supporting development of analysis/testing of delivered products for design verification to ensure a smooth transition into production

This is a dual band requisition and candidates will be considered at both levels per the qualifications listed below.

Basic Qualifications level 2:

To be considered for this position, you must minimally meet the knowledge, skills, and abilities listed below:

  • Bachelors in an engineering or science discipline and2 years of experience in microelectronics packaging design or related area or a Master's Degree with 0 years experience

  • Must be able to obtain a Secret Clearance, U.S. Citizenship is a pre-requisite

Basic Qualification level 3:

  • Bachelors in an engineering or science discipline5 years of experience in microelectronics packaging design or related area or a Master's Degree with 3 years or experience.

  • Must be able to obtain a Secret Clearance, U.S Citizenship is a pre-requisite

Preferred Qualifications:

  • Experience with AutoCAD

  • Experience with NX or other 3D modeling software

  • Active DOD Secret Clearance

  • Experience with chip-scale packaging

  • Familiar with Printed Wiring Board (PWB) design and fabrication

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please U.S. Citizenship is required for most positions.

Title: Mechanical Engineer, Microelectronics Packaging Design 2/3

Location: Maryland-Baltimore

Requisition ID: 18002434