Northrop Grumman Manufacturing Project Engineer/Principal Project Engineer -Microelectronics Assembly and Packaging in Baltimore, Maryland

Northrop Grumman's Manufacturing Operations Engineering organization is seeking a Manufacturing Project Engineer for the Advanced Microelectronics Cell (AMEC). This position focuses on Microelectronics Assembly and Packaging.

The Manufacturing Project Engineer responsibilities include, but are not limited to, the tasks outlined below:

Hands on evaluation of non-compliant hardware to determine rework

Providing ROI justification for process improvements

Developing/revising process documentation and work instructions

Assisting with design of custom tooling

Facilitating Root Cause & Corrective Action tasks and driving to closure

Solving of manufacturing problems (related to materials, designs, equipment, people) in a timely manner

The chosen candidate must have excellent verbal and written communication skills; be able to multi-task in a fast-paced, dynamic, and high visibility environment; and work well as part of a team.

This req may be filled as a Project Engineer or a Principal Project Engineer based on the qualifications below.

MANUMS

Basic Qualifications for a Project Engineer:

Bachelor of Science degree or higher in Engineering or related STEM area plus 2 years of relevant professional experience (0 years with an MS degree

Project Management or Process Engineering experience

Familiarity with Design of Experiment (DOE), Statistical Process Control (SPC), 6 sigma concepts for process development, and control

Knowledge of Geometric Dimensioning and Tolerancing (GD&T)

Fluency in MS Office software applications

Ability to obtain and maintain a US Secret Security Clearance (US Citizenship is required.)

Basic Qualifications for a Principal Project Engineer:

Bachelor of Science degree or higher in Engineering or related STEM area plus 5 years of relevant professional experience (3 years with an MS degree

Project Management or Process Engineering experience

Familiarity with Design of Experiment (DOE), Statistical Process Control (SPC), 6 sigma concepts for process development, and control

Knowledge of Geometric Dimensioning and Tolerancing (GD&T)

Fluency in MS Office software applications

Ability to obtain and maintain a US Secret Security Clearance (US Citizenship is required.)

Preferred Qualifications:

Knowledge of microelectronics technology and materials

Familiarity with J-STD and MIL-STD requirements and Space Class hardware requirements

Experience with semiconductor device soldering processes

Experience with automated pick and place equipment

Experience with autowirebond or wedgebond equipment

Experience with automated milling and chip removal equipment

Experience with laser and ink marking systems

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit www.northropgrumman.com/EEO. U.S. Citizenship is required for most positions.