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Northrop Grumman Principal or Sr Principal Microelectronics Semiconductor Facilities Process Engineer in Apopka, Florida

At the heart of Defining Possible is our commitment to missions. In rapidly changing global security environments, Northrop Grumman brings informed insights and software-secure technology to enable strategic planning. We're looking for innovators who can help us keep building on our wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies that fuel those missions. By joining in our shared mission, we'll support yours of expanding your personal network and developing skills, whether you are new to the field or an industry thought-leader. At Northrop Grumman, you'll have the resources, support, and team to do some of the best work of your career.

Northrop Grumman Mission Systems is seeking a Semiconductor Facility Engineer for our Advanced Packaging Technology Fab - located in Apopka, Florida.

Northrop Grumman's semiconductor foundry and packaging lines have unique capabilities of supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development.

The wafer bumping line, will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions, including tin/lead, lead-free, microbumps, and copper pillar, using sputter, electro and electro-less plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging.

PRIMARY FUNCTION:

Maintain, test, overhaul, modify/upgrade/redesign as required facilities equip to support a Si wafer processes Fab. The types of equipment include but are not limited to acid waste neutralization system, deionized / reverse osmosis water system, Liquid Nitrogen plant, air scrubber system, and support of hazardous waste collection and management. A preferred candidate will also have experience with equipment maintenance with a variety of electro-mechanical-optical-chemical test and manufacturing equipment types used in the production and test of solid state devices.

WORKING PROCEDURE AND/OR RESPONSIBILITY ASSIGNED:

  1. Perform scheduled and as needed preventative and regular maintenance to facilities support suite of equipment.

  2. Devise and initiate modifications to equipment to improve maintainability, operation, or reliability.

  3. Determine methods and techniques for effectively monitoring status and operating parameters on complex systems.

  4. Collect and analyze data on system status/failures for SPS usage and recommend corrective action.

  5. Determine the effect of engineering changes on the total system and initiate action necessary to ensure compatibility.

  6. Design, develop and construct special tools as applicable for support facilities equipment.

  7. Perform initial procedural tests on new and/or changed equipment, make modifications as required, record, and analyze data and supply reports of test specifications in required form.

**This position will be filled at either the Principal Engineer or Sr Principal Engineer

MANUMS

Qualifications:

Basic Qualifications:

Basic Qualifications for a Principal Semiconductor Equipment Engineer:

  • Bachelor's degree in a technical area with 5 years of relevant experience; 3 years' experience with a technical Masters; or with a PhD, 12 years of experience required with a technical Associates of Science

  • Minimum of 3 years' experience working with semiconductor fabrication equipment or the construction industry

  • Experience with semiconductor wafer fabrication facilities and operation

  • Experience with fab facility, equipment installation, and maintenance.

  • Demonstrated ability to work with cross organizational teams such as engineering, line maintenance and building maintenance

  • Strong leadership and communication skills.

  • Must be a US Citizen and able to obtain and maintain a Secret clearance

Basic Qualifications for a Sr Principal Semiconductor Equipment Engineer:

  • Bachelor's degree in a technical area with 9 years of relevant experience; 7 years' experience with a technical Masters; or with a PhD with 4 years' experience, 12 years of experience required with a technical Associates of Science

  • Minimum of 5 years' experience working with semiconductor fabrication equipment or the construction industry

  • Experience with semiconductor wafer fabrication facilities and operation

  • Experience with fab facility, equipment installation, and maintenance.

  • Demonstrated ability to work with cross organizational teams such as engineering, line maintenance and building maintenance

  • Strong leadership and communication skills.

  • Must be a US Citizen and able to obtain and maintain a Secret clearance

Preferred Qualifications:

  • Experience with semiconductor clean room design and construction.

  • Experience with Architecture and Engineering ("A&E") drawing sets

  • Experience with AutoCAD design

  • Proven track record managing strategic projects from inception through completion; including financial, risk and schedule management

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit www.northropgrumman.com/EEO. U.S. Citizenship is required for most positions.

Job Category : Engineering

20027353

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